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Full Auto wafer sorting system
NC-3000£Ò
- Res : 0.001¡­60¥Ø¡¤cm
- Thickness : 150¡­800¥ìm
- PN : 0.1~1000¥Ø¡¤cm in resistivity
- Applications : Silicon wafer (Raw slice, Lapped, Mirror, Etched, Polished)
- Wafer sizes : 12"¦ (or 6"¦ and 8"¦)


The system automatically measures resistivity, thickness and P/N of silicon wafers without contacting. The system provides high throughput, cassette wafer measurement/sorting and is designed/manufactured by NAPSON.

- High speed and clean wafer robot

- Non-contact measurement for resistiviity, thicknes and P/N type of silicon wafers

- High precision and high stability measurement

- Stanard 7 cassette stations for loader/unloader (CCW rotary mechanism)