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Full Auto Type
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Full Auto Type
In-line Type
Handy type
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Full Auto Rs measurement system
WS-3000
- Res : 1¥ì~1M¥Ø¡¤cm
- Rs : 1m~10M ¥Ø/sq (option : 1G ¥Ø/sq)
- Applications : Silicon wafer, Semiconductor process
                      (Metal thin film, Diffused, Ion-implanted, Epitaxial, Poly silicon)
- Size : Up to ¦12"



- High reliable measurement with high performence tester and 4 point probe head, stable wafer loading mechanism

- Automatic probe head selection (exchanger) among four kinds of probe with rotary mechanism

- Dual mode enable highly accurate measurement (edge 1mm capability)

- The measurement capability 3nm~1500nm for thin films

- 49 points mapping / 60 seconds (300mm wafer)

- Tact time : less than 120 seconds / wafer
                 (includes load~49points meas. ~unload)

- FOUP (one or two ports) and GEM/SECS network compatible

- FFU (ULPA) mini-environment

- Standard mapping (2-D, 3-D) measurement up to 1225 points and optional user programmale mapping

- 200mm SMIF/AM3000 compatible with option