Napson Corporation
Jandel Engineering Limited
MTI Instruments
Jova Solutions
제조사별 제조사별
Manual Res/thickness measurement system
EC-80SCAN
- Rs : 0.01~3000 Ω/sq
- Res : 0.001~200 Ω·cm
- Thickness : 150~350 μm or 350~750 μm 
- Applications : Silicon wafer, GaAs Epi, GaN, GaP, ITO and metal layers
- Size : 3"~8", or Max. 156mmSQ




- Display resistivity and thickness of a silicon wafer with one measurement

- Possible to measure a continuous one line for the resistivity and
  thickness of a wafer by the SCAN measurement mode


- Operator can handle the wafer easily by the air floating measurement stage

- Measurement data saving and transfer the text file to PC (via RS-232C)

- Easy set up to measurement condition by JOG dial operation

- With temperature correction for silicon wafers

- Res : Low – 0.001~0.05 Ω·cm                            Rs : Low – 0.01~0.5 Ω/sq
            Middle – 0.05~0.5 Ω·cm                                   Middle – 0.5~10 Ω/sq
            High – 0.5~60 Ω·cm                                         High – 10~1000 Ω/sq
            Super High – 60~200 Ω·cm                              Super High – 1000~3000 Ω/sq
            Solar Wafer – 0.2~15 Ω·cm                              Solar - 5~500 Ω/sq