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 제조사별 |
 제조사별 |
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Non-contact sheet resistance mapping system |
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NC-300SCAN |
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- Rs : 0.05~2 Ω/sq
- Applications : Cu film on silicon wafer (silicon wafer t : approx. 750μm)
(Cu film thickness : 1000～3000A)
- Sample sizes : up to 8"Ф |
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- Single sided eddy current probe(upper side) with air flouting
- Diameter of probe : 10mm
- Measuring range : 0.05 ~ 2 ohm/sq (at film thickness : approx.2000A)
- Performance:
- Conforms to ASTM F673
- Measurement repeatability
CV : less than 0.2% (30 times in stop condition) [CV=STDEVP/AVG×100(%)]
- Probing stage
- High speed Y-θaxes motor controlled
The measurement is performed from the circle of edge to inside,
and the final is the center.
- Tact time : less than 90sec./121 points
- Mechanical accuracy of stage
θ-axis : repeatability of positional precision：±0.01°
Y-axis : repeatability of positional precision：±0.05mm
- The distance between single side probe and stage：12.5mm
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