Napson Corporation
Jandel Engineering Limited
MTI Instruments
Jova Solutions
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Manual Res/thickness measurement system
EC-80SCAN
- Rs : 0.01~3000 ¥Ø/sq
- Res : 0.001~200 ¥Ø¡¤cm
- Thickness : 150~350 ¥ìm or 350~750 ¥ìm 
- Applications : Silicon wafer, GaAs Epi, GaN, GaP, ITO and metal layers
- Size : 3"~8", or Max. 156mmSQ




- Display resistivity and thickness of a silicon wafer with one measurement

- Possible to measure a continuous one line for the resistivity and
  thickness of a wafer by the SCAN measurement mode


- Operator can handle the wafer easily by the air floating measurement stage

- Measurement data saving and transfer the text file to PC (via RS-232C)

- Easy set up to measurement condition by JOG dial operation

- With temperature correction for silicon wafers

- Res : Low – 0.001~0.05 ¥Ø¡¤cm                           Rs : Low – 0.01~0.5 ¥Ø/sq
           Middle – 0.05~0.5 ¥Ø¡¤cm                                   Middle – 0.5~10 ¥Ø/sq
           High – 0.5~60 ¥Ø¡¤cm                                          High – 10~1000 ¥Ø/sq
           Super High – 60~200 ¥Ø¡¤cm                              Super High – 1000~3000 ¥Ø/sq
           Solar Wafer – 0.2~15 ¥Ø¡¤cm                              Solar - 5~500 ¥Ø/sq