- High reliable measurement with high performence tester and 4 point probe head, stable wafer loading mechanism

- Automatic probe head selection (exchanger) among four kinds of probe with rotary    mechanism

- Dual mode enable highly accurate measurement (edge 1mm capability)

- The measurement capability 3nm~1500nm for thin films

- 49 points mapping / 60 seconds (300mm wafer)

- Tact time : less than 120 seconds / wafer
                    (includes load~49points meas. ~unload)

- FOUP (one or two ports) and GEM/SECS network compatible

- FFU (ULPA) mini-environment

- Standard mapping (2-D, 3-D) measurement up to 1225 points and optional user  programmale mapping

- 200mm SMIF/AM3000 compatible with option